Program
17 November (Sunday), 2024
18:00 – 20:30 | Pre-registration (Hotel Slovenija 5*) |
19:00 – 20:30 | Welcome reception (Hotel Slovenija 5*; Piano bar) |
18 November (Monday), 2024
08:00 – 09:00 | Registration (Hotel Slovenija 5*) | |
08:45 – 09:00 | James COOK Hall | Opening Ceremony Chairman: Peter Krajnik |
Opening addresses | Peter Krajnik – Symposium Chairman Franci Pusavec – Symposium Co-Chairman Xun Chen – ICAT Chairman Daisuke Shimizu – JSAT President | |
09:00 – 09:30 | Keynote speech 1 Innovating carbon-dioxide machining for medical applications Franci Pusavec University of Ljubljana, Slovenia | |
09:30 – 10:00 | Keynote speech 2 Advances in modeling of fixed-abrasive processes Peter Krajnik Chalmers University of Technology, Sweden | |
10:00 – 10:30 | Coffee Break/Official Photo of ISAAT2024 | |
10:30 – 11:00 | Keynote speech 3 Ultraprecision machine tools and on-machine metrology for optical element manufacturing Shinya Morita Tokyo Denki University, Japan | |
General Session (James COOK Hall) Chairman: Xun Chen | ||
11:00 – 11:20 | Case studies of grinding industrial components made of difficult-to-grind materials using electroplated superabrasive wheels Zhongde Shi, Helmi Attia and Jean-Michel Lamarre | |
11:20 – 11:40 | Analysis of grinding of the cutting insert nose radius with the application of the theory of aggressiveness Carlos E. H. Ventura, Eraldo J. Silva, Radovan Dražumerič, Jeffrey Badger and Peter Krajnik | |
11:40 – 12:00 | Atomic diffusion additive manufacturing: optimizing surface finish and mechanical properties of 17-4 PH stainless steel through mass finishing techniques Xiaoxiao Liu, Tahsin Tecelli Opoz, Martar Njie, Juan Ignacio Ahuir Torres and Xun Chen | |
12:00 – 13:00 | Lunch |
Time | James COOK Hall | Roald AMUNDSEN Hall | Robert SCOTT Hall |
13:00 – 15:00 | Abrasive Machining I Zhongde Shi | Fine-Finishing Technology I Binghai Lyu | Process Monitoring, Measurements, and Metrology Teppei Onuki |
13:00 – 13:20 | Laser-assisted cylindrical grinding of superhard diamond composite (DSiC) materials Masih Paknejad, Bahman Azarhoushang, Robert Bösinger and Esmaeil Ghadiri Zahrani | Influence of lapping trajectory on the surface roughness of cylindrical roller Juru Yang, Binghai Lyu, Qianfa Deng, Yunxiao Han, Jiahuan Wang, Wei Hang and Hongyu Chen | Object identification on working surfaces of grinding wheel for semiconductor processing using micro-raman imaging Teppei Onuki, Ryohei Tazawa, Ryou Taguchi, Hirotaka Ojima, Jun Shimizu and Libo Zhou |
13:20 – 13:40 | Characteristics of high-speed reciprocation profile grinding Nobuhito Yoshihara, Hiromasa Kano and Masahiro Mizuno | Evaluation of material removal rates on top and bottom surfaces under different workpiece thickness conditions in double-sided lapping Ryuki Shibasaki, Yohei Hashimoto and Tatsuaki Furumoto | Observation of blind edge-defects in ceramic cutting tool using microscopic Raman imaging Teppei Onuki, Ryou Taguchi, Shuo Liu, Ryohei Tazawa, Hirotaka Ojima, Jun Shimizu and Libo Zhou |
13:40 – 14:00 | An experimental study on the relation between normal force and material removal when surface grinding with elastic wheels Einar Martin, Leire Godino, José Antonio Sánchez and Iñigo Pombo | Investigation of effect of rotation and revolution speeds in centrifugal barrel finishing of magnet workpieces Yohei Hashioto, Kohei Yamaya, Minoru Ito and Tatsuki Kawahara | Detection of chips loading on diamond coated drill with on-machine captured drill image Kousuke Kato, Tatsuya Furuki, Koichi Nishigaki and Takashi Suda |
14:00 – 14:20 | Modeling and experimental study of grinding force on the inner surface of fiber-reinforced composite tubes Zijun Zhu, Xianglong Zhu, Renke Kang, Zhigang Dong and Zhiyuan Zhang | Analysis of processed surface by gyro barrel finishing with large spherical alumina media Kenta Miyake, Yohei Hashimoto, Tatsuaki Furumoto, Tomohiro Koyano and Mitsugu Yamaguchi | AI prediction of the state of five kinds of tool wear by only observing the chip back-surface temperature near the chip root Jun Shinozuka |
14:20 – 14:40 | Simulation reproduction of workpiece temperature variation under continuous grinding Yujun Wu and Weimin Lin | A study for the influences of polishing pressure force and sliding velocities on the material removal rate of the fused silica polishing with ceria slurry by using molecular dynamics simulation Juan I. Ahuir-Torres, Xun Chen, Yasemin Akar, Paul A. Bingham, Frankie F. Jackson, Hongyu Li, Rakesh Mishra, Arun Soman-Pillai, David D. Walker and Guoyu Yu | Grinding burn monitoring by cluster analysis of acoustic emission signal using shaped base distance Hideaki Tanaka, Xu Liu Bin Zi and Zhao Lutong |
14:40 – 15:00 | Effect of different dresser tip shape and dressing conditions on grinding characteristics and grinding wheel wear Gen Uchida and Takazo Yamada | A novel magnetic compound fluid polishing wheel and its performance in ultra-precision finishing of single-crystal silicon mirror Yufeng Xue, Jingru Li, Yanjun Lu, Yangke Zheng and Yongbo Wu | Development of measurement method for the grinding fluid distribution in the contact arc Tatsuki Ikari and Takayuki Kitajima |
Coffee Break 15:00 – 15:30 | |||
Time | James COOK Hall | Roald AMUNDSEN Hall | Robert SCOTT Hall |
15:30 – 16:50 | Abrasive Machining II Bahman Azarhoushang | Fine-Finishing Technology II Chun-Wei Liu | Ultrasonic Machining Xipeng Xu |
15:30 – 15:50 | Investigation of force and material removal mechanisms of 2.5D SiCf/SiC composites during single diamond scratching. Qi Zhang, Ben Wang and Zhongao Shi | Electrolysis combined shear thickening polishing method Yafeng Zhou and Binghai Lyu | Effect of tungsten ultrasonic elliptical vibratory cutting process on surface dislocations and morphology Kaixuan Wang, Renke Kang, Yan Qin, Guolin Yang, Xiaoguang Guo and Yan Bao |
15:50 – 16:10 | Research on compensation methods for ultra-precision single-point diamond turning of aspherical surfaces Linhui Xu, Xipeng Guo and Shaohui Yin | Material removal function of deterministic shear thickening polishing using wedge structure polishing tool Lanying Shao and Binghai Lyu | Feasibility study of ultrasonic elliptical vibration turning with carbide tool on high density tungsten alloy Hao Su, Yan Bao, Yidan Wang, Jiansong Sun, Chengwei Kang and Zhigang Dong |
16:10 – 16:30 | UV laser assisted micro-grooving of binder-less cemented carbide Using Ⅱa type monocrystalline dimond toll Yiwen He, Akinori Yui and Hirofumi Suzuki | Electrochemical shear-thickening polishing of single-crystal silicon carbide Mengmeng Shen, Wei Hang and Hongyu Chen | Development of model-based process simulation technique for ultrasonic assisted grinding of quartz glass Masayuki Takahashi, Kanta Ogura, Kaima Shimomura, Shun Otaka and Norikazu Suzuki |
16:30 – 16:50 | Study on machining anisotropy of Si face of N-type 4H-SiC by nanoscratching experiments Yuto Mochizuki, Kengo Saegusa, Jun Shimizu, Kazuki Kaneko, Takeyuki Yamamoto, Teppei Onuki, Hirotaka Ojima and Libo Zhou | Experimental study on chemical mechanical polishing of single crystal diamond by UV photocatalytic – Fenton composite reaction Qiang Xiong, Jiabin Lu and Qiusheng Yan | Solid lubrication performances of metal surfaces textured by vibration-assisted cutting Kaito Kunitan, Jun Shimizu, Kazuki Kaneko, Takeyuki Yamamoto, Teppei Onuki and Hirotaka Ojima |
19 November (Tuesday), 2024
Time | James COOK Hall | Roald AMUNDSEN Hall | Robert SCOTT hall |
08:40-10:00 | Fine-Finishing Technology III Jun Shimizu | Advanced Cutting Technology Franci Pusavec | Grinding Wheel and Abrasive Grain Technologies Akinori Yui |
08:40 – 09:00 | Force rheological polishing of polycrystalline magnesium aluminate spinel using agglomerated diamond abrasive Mengqing Liu, Jinhu Wang and Julong Yuan | Energy saving parameter decision making for orthogonal turn-milling through specific energy model and multi-objective optimization algorithm Ke-Er Tang, Ta-Hsin Chou and Chun-Wei Liu | On performance of patterned brazed wheels with cubo-octahedral diamond grains during coarse grinding of cemented carbide Trilochan Prasad Nanda and Amitava Ghosh |
09:00 – 09:20 | Research on plasma assisted force rheological polishing of silicon carbide Xuelai Li and Julong Yuan | Preliminary research on delamination damage in milling of multilayer Fe-based amorphous alloy laminated materials Yang Jia Li, Cheng Yong Wang and Feng Ding | Additive manufacturing metal-bonded diamond bit and performance assessment Jianyu Wang, Guoqin Huang, Hui Huang, Yuanqiang Tan and Xipeng Xu |
09:20 – 09:40 | Experimental study on the polishing process of WC-10Co-4Cr coating on the inner ring of spherical plain bearing Zhenyu Jiang and Chen Jiang | Effect of the pilot hole on the cutting phenomena in high-speed cutting of an internal thread by a thread mill Jun Matsunoshita, Shota Matsui, Toshiki Hirogaki and Ryo Matsuda | Fabrication, characterization and grinding performance of CVD diamond coated Ni-based brazed diamond grinding tools Liu Dongdong, Zhu Haojie and Sun Fanghong |
09:40 – 10:00 | Covalently armoring graphene on diamond abrasives for high-performance polishing of polycrystalline diamond Qiang Lin, Sulin Chen, Joachim Seidelmann and Bin Shen | Consideration of temperatures of spindle body and cooling fluid for designing feedback control system of thermally induced spindle displacement Yohichi Nakao, Ryota Ishida, Jumpei Kusuyama and Shumon Wakiya | Wear behavior of oscillating heat pipe grinding wheel during grinding of nickel-based superalloy Ning Qian, Yucan Fu and Jiiuhua Xu |
Coffee Break 10:00 – 10:30 | |||
Time | James COOK Hall | Roald AMUNDSEN Hall | Robert SCOTT Hall |
10:30 – 12:10 | CMP and Semiconductor Wafer Processing Kai-Jung Chen | Eco-Machining Jun Wang | Mixed Session I Kazuhito Ohashi |
10:30 – 10:50 | Utilizing spindle load monitoring for stability analysis of 4H-SiC wafer grinding Chun-Yen Chen, Jung-Tsai Tsai, Ming-Yi Tsai and Kai-Jung Chen | Improving the grindability of Ti-64 via application of MQL Rakesh Kandulna, Amal Gupta, Prithviraj Mukhopadhyay and Venkateswara Rao | Shape accuracy prediction and experimental verification for honed bore in pressure-adaptive honing processes Yingying Yuan, Changyong Yang, Hao Su, Yucan Fu, Jiuhua Xu and Wenfeng Ding |
10:50 – 11:10 | Analysis of diffusion in Fe/4H-SiC by molecular dynamics method Huang Yuxiang, Huang Hui, Xu Xipeng and Duan Nian | A study of the effectiveness of lubricated carbon dioxide in improving the grindability of hard materials Deepa Kareepadath Santhosh, Philipp Hoier, Franci Pušavec and Peter Krajnik | Effect of shear stress direction on surface appearances of cracks formed by wheel scribing Kumiko Murakami, Souta Matsusaka, Sho Itoh, Hirofumi Hidai and Mitsuru Kitaichi |
11:10 – 11:30 | Molecular dynamics simulation of silicon CMP with potential control Jun Shimizu, Kazuki Kaneko, Norika Hashimura, Teppei Onuki, Hirotaka Ojima and Libo Zhou | Grinding performance of ZTA nanocomposite ceramics under ternary-hybrid nanofluid minimum quantity lubrication Xianpeng Zhang, Peng Yao, Peifa Zhou, Mingwu Hao, Shuoshuo Qu, Dongkai Chu, Hongtao Zhu, Bin Zou, Hanlian Liu, Chuanzhen Huang | Study on shape generation for Titanium alloys by overlapping grooves in scanning ECM with electrolyte suction tool Takahiro Inadama and Wataru Natsu |
11:30 – 11:50 | Study of process parameters for atmospheric plasma etching of silicon carbide wafers Yanfang Dong and Julong Yuan | Development of technology for anti-corruption of water-soluble grinding fluid due to ultraviolet irradiation Sena Hosokawa, Takanori Fujiwara, Hiroyoshi Suzuki, Yoshiki Isokane, Shunsuke Fukata, Takashi Onishi, Hiroko Tada, Chiyuu Nakano, Jyun Naohara, Itsuo Urakami and Kazuhito Ohashi | Study on visualization of deforming behavior of micro form rolling Satoshi Ikenaga, Keishi Yamaguchi, Akira Yoshida and Masaki Sato |
11:50 – 12:10 | Development of a process model of micro-nano patterns toward a novel model-based process control in chemical mechanical polishing Taku Ishihara and Norikazu Suzuki | Cutting hard and brittle materials using a fixed diamond wire tool: Effect of slurry-assisted slicing on the machining surface Akira Oga, Shinya Moriyama, Tatsuki Otsubo and Takanori | Machining characteristics of nanoparticle suspensions in abrasive machining of brittle materials Shuiquan Huang, Baosu Guo, Meina Qu and Chuanzhen Huang |
Lunch 12:10 – 13:10 | |||
Poster session 13:10 – 14:30 (Piano Bar) | |||
Time | James COOK Hall | Roald AMUNDSEN Hall | |
14:30 – 15:50 | EDM and Non-Traditional Machining José Antonio Sánchez | Mixed Session II Hui Huang | |
14:30 – 14:50 | Estimation of actual machining depth in small-hole EDM Shibuya Yoshiki and Hideki Takezawa | Investigation on surface roughness of graphite in high-speed milling with micro-edge tools Shoufeng Chen, Feng Ding, Yaoan Lu and Chengyong Wang | |
14:50 – 15:10 | Bottom cutting high-speed EDM using hybrid thin plate electrode Keisuke Takeuchi and Hideki Takezawa | Optimization of friction welded joining for different materials by an automatic lathe Hidetake Tanaka | |
15:10 – 15:30 | Fabrication of high aspect ratio micro-cylindrical array electrodes based on micro-prismatic electrode wear during EDM Liya Jin and Yadong Gong | Surface texture for improving wear resistance of phosphorous tin alloy using biomachining Jingyu Song, Hui Huang, Weibin Shi, Xinjiang Liao and Xipeng Xu | |
15:30 – 15:50 | EDM property by ultra fine bubbles containing various gases Satoshi Anzai, Manabu Iwai, Muzhi Li and Shinichi Ninomiya | ||
Symposium dinner 19:00 (venue: Hotel Slovenija 5*; Cristoforo COLOMBO Hall) |
Poster Presentations
Time: 13:10 – 14:30, 19th November, 2024
Place: Hotel Slovenija 5*, Piano Bar
P01 | Coolant condition and spindle power in high-efficiency-deep-grinding of nickel-based superalloy profile part Yucan Fu, Ning Qian and Jiuhua Xu |
P02 | Material removal mechanism of continuous fiber reinforced Ti matrix composites of ultrasonic vibration-assisted grinding Wenfeng Ding, Biao Zhao and Tao Chen |
P03 | Enhancing mechanical performance of ADAM-fabricated 17-4 PH stainless steel through post-processing techniques Tahsin Opoz, Andrew Burgess, Juan Ignacio Ahuir-Torres, Hiren Kotadia and Samuel Tammas-Williams |
P04 | Super-smooth processing technology of CVD-SiC with the combination of Electrolytic In-process Dressing (ELID) grinding and fixed softer-than-diamond abrasive grinding Xuemei Ao, Syuhei Kurokawa and Terutake Hayashi |
P05 | Preparation of porous vitrified bond composite grinding wheel and reactive grinding of PCD film Shaofeng Huang and Jing Lu |
P06 | Development of an intelligent CAM system with on-machine automatic deburring function: study of burr detection algorithm Mikio Fujio, Tsubasa Kikuchi and Kentaro Ootsuka |
P07 | Influence of surface conditions of superabrasive grinding stone with mechanochemical action on superfinishing of single crystal silicon Furushiro Naomichi, Tomomi Yamaguchi, Daisuke Hirooka, Katutoshi Sumida and Kenichi Tanada |
P08 | Data-driven grinding operations: AI-capable platform for remote data aggregation and monitoring – GamayunAI DTM Tadej Justin, Viktor Brajak and Peter Krajnik |
P09 | Study on performance degradation of water-soluble grinding fluids due to corruption and methods for its prevention Sena Hosokawa, Takanori Fujiwara, Hiroyoshi Suzuki, Yoshiki, Isokane, Shunsuke Fukata, Takashi Onishi, Hiroko Tada, Chiyuu Nakano, Jyun Naohara, Itsuo Urakami and Kazuhito Ohashi |
P10 | Glass press molding by ultraprecision machined binderless cemented carbide microlens array molds with nano-polycrystalline diamond tools Shinya Morita and Yutaka Yamagata |
P11 | Primary study on micro/nano-scale process simulation for ultrasonic assisted grinding of hard brittle materials Shun Otaka, Masayuki Takahashi and Norikazu Suzuki |
P12 | Machinability improvement of Titanium alloy in face grinding by ultrasonic enhanced jet plasma oxidation Hanqiang Wu, Shibo Zhang, Genzhuo Li, Sisi Li, Chen Xiao and Yongbo Wu |
20 November (Wednesday), 2024
Technical tour of Slovenia
21 November (Thursday), 2024
THE END – Organization of transfers to the airport